Abakhiqizi abakhulu bokulawula bajoyina ekususweni kwempahla, amanani enkumbulo ayaqhubeka nokuwohloka, imakethe yokugcina impahla kufanele ivikele ukungqubuzana kwangaphakathi komjikelezo ononya wemakethe nesidingo.

Izingqungquthela ezimbili zibanjwa enhloko-dolobha, futhi umgomo wokukhula ngo-5% obekwe kulo nyaka awushintshile, okusobala ukuthi kuwukubonakaliswa okungenalusizo kweqiniso lobunzima bezomnotho.

Ngokumelene nesizinda sendawo yonke engeyinhle, ukusebenza kwemakethe yesitoreji kuleli sonto kukhathaza kakhulu ngemuva kwesikhathi esidlule sokwehla okuqhubekayo.

Kungakhathaliseki ukuthi ukungasebenzi kahle kukaMicron okungase kudilize abasebenzi abaningi, noma idatha ye-chip ekhuphukayo yemboni ye-semiconductor e-South Korea, ethembele kakhulu ekugcinweni, sekubi kakhulu kangangokuthi asikho isidingo sokusho okwengeziwe.

Mayelana nezimboni zamamojula kanye nesidingo sokugcina, kukhona nezindaba zokuthi imali etholwa yiMacronix ngoFebhuwari yehle ngaphezu kuka-40% unyaka nonyaka, uJinghaoke walahlekelwa yi-NT$800 million ezintengo zokusungula, kanye nebhizinisi.I-SSDimali engenayo yehle cishe ngama-30% ku-Q4 ngonyaka odlule.

Kafushane, isimo samanje "sobusika siyeza" emakethe yesitoreji sesithathe isimo.Ngaphezu kwalokho,I-SSDabakhiqizi abakhulu bokulawula benze umnyakazo omkhulu wokususa i-inventory, futhi umbuthano ononya wezimo zemakethe ezingezinhle kanye nesidingo esibandayo sesibe yingozi enkulu ukuthi bonke abantu abagcina impahla kufanele baqaphe ngokwanele.

Ngokuphambene, izindaba zokuthi uWinbond kanye ne-ADATA baqophe ukukhula kwemali engenayo engaphezu kuka-10% inyanga nenyanga ngoFebhuwari zisabonakala zibuthakathaka.

I-SSDimakethe yesimo esiqinile

Kuleli sonto, ingqikithiI-SSDimakethe isesehla, inesidingo esincane sokuhleleka futhi akukho shintsho kumthamo wokwenziwe.Kulandela ukuncishiswa kwama-chip wafers asekuqaleni, abalawuli nabo bafakwe ngokusemthethweni ekukhishweni kwempahla, ngokuncipha okungama-30%.Abanye abangaphakathi embonini baveze ukuthi, ngaphandle kokwanda kwemibuzo emakethe yeseva, ezinye izimakethe zabathengi ziyahlupheka, futhi sekuyisikhathi sokuhlolwa kwangempela.Ukwehla kuzokwenza ukuthi isidingo sibe sibi kakhulu, futhi imakethe ngaphandle kwesidingo izoba yimbi kakhulu, ingene kumbuthano ononya wokungqubuzana kwangaphakathi.Nginxusa wonke umuntu ukuthi ayiphathe ngokunengqondo, futhi angasebenzi ngaphandle komkhawulo!

Kuleli viki,I-NVMEkucashunwe cishe, futhi wonke umthamo ukhombise ukwehla, ngokwehla okungaba ngu-1% -2%;

OEM PCBA: emhlabeni 85/126/245/630.

Izingcaphuno zemakethe ze-SATA 3.0 zaleli sonto, wonke amakhono asezingeni eliphansi, ngebanga lokwehla elingu-1% -4%;

I-OEM PCBA: 120G/240G/480G/960G/2T Ikhotheshini (ngaphandle kokupakishwa, njll.): 40/70/120/240/530

Imakethe yenkumbulo ye-DRAM

Imakethe ye-DRAM isempofu kuleli sonto, intengo yemakethe iyonke iyaqhubeka nokwehla, umthamo wokuthengiselana nawo uyancipha, futhi isidingo sibuthakathaka kakhulu.Akufanelekile ukwandisa i-inventory esikhathini esizayo esiseduze, futhi ukusebenza okukodwa kuya kokukodwa kuyinhloko.

Kuleli sonto, izingcaphuno zemakethe ye-OEM yenkumbulo zikhombisa ukwehla kwawo wonke amakhono, ngebanga lokwehla elingu-4% -6%.Emkhakheni we-D3, wonke amakhono asezingeni eliphansi, ngebanga lokwehla elingaba ngu-3% -7%.

Ikhotheshini yomkhiqizo: (intengo ingeyereferensi kuphela, imakethe iyashintshashintsha)

D4 2666 32G: 375-452

D4 2666 16G: 164-211

D4 2666 8G: 86-110

I-D4 2666 4G: cishe ku-60-91.

IFLESHIimakethe yezinhlayiya

Imakethe yendawo yezinhlayiya ze-FLASH ibithule kuleli sonto, futhi intengo iqhubekile nokwehla.Ingcaphuno yewafer yasekuqaleni, ikhotheshini ye-128G/64GTLC Good Die wafer icishe ibe ngamadola ase-US angu-3.4/1.8, intengo yangempela yokwenziwayo iphansi, futhi ukugcwala okugcwele kukonke kuhlala kungashintshile.Itheminali iyavilapha, futhi abahwebi bayalinda babone, ngokuyisisekelo basesimweni somuntu oyedwa.Ungacabangi kakhulu okwamanje, gcina ukusebenza komuntu ngamunye, futhi akufanelekile ku-inventory.

I-USB 2.0/I-USB 3.0/Ikhadi le-TFimakethe

Kuleli sonto, intengo yemakethe ye-USB isalokhu yehla kancane, isidingo asikathuthuki, futhi kusekhona indawo yokwehla kwamandla amakhulu.Akukho ukuthunyelwa okukhulu kwama-granules, amanani enkontileka ye-Good Die wafer ayaqhubeka nokwehla, futhi abadayisi bayaqhubeka nokulinda futhi babone ukugeleza.

Kuleli sonto, izingcaphuno ezivamile ze-PCBA, ngaphandle kwamakhono e-4G kanye ne-128G, zisezingeni eliphansi, ngebanga lokwehla elingu-1% -3%;

I-UDP icishe icashunwe kuleli sonto, ngakho umthamo usekuthambekeni okwehlayo, futhi ububanzi bokwehla buba ngu-1% -4%;

Kuleli sonto, imakethe ye-USB 3.0 icashunwa cishe, futhi wonke amakhono asezingeni eliphansi, ngebanga lokwehla elingu-1% -4%;

Kuleli sonto, iIkhadi le-TFamanani acashuniwe emakethe ngokuvamile.Ngaphandle komthamo we-64G, amanye amakhono abonise ukuthambekela okwehlayo, futhi uhla lokwehla lwaluzungeze u-2% -3%.