Inqubo yokucubungula ye-Nand Flash
I-NAND Flash icutshungulwa kusuka kokubalulekile kwe-silicon, futhi impahla ye-silicon icutshungulwa ibe ama-wafers, ngokuvamile ahlukaniswa ngamayintshi angu-6, amayintshi angu-8, nama-intshi angu-12.I-wafer eyodwa ikhiqizwa ngokusekelwe kulo lonke leli phepha.Yebo, zingaki i-wafer eyodwa engasikwa ku-wafer kunqunywa ngosayizi wefayizi, usayizi we-wafer kanye nezinga lesivuno.Ngokuvamile, amakhulukhulu ama-NAND FLASH chips angenziwa ngewafa eyodwa.
Iwafa eyodwa ngaphambi kokupakishwa iba yi-Die, okuwucezu oluncane olusikwe ku-Wafer nge-laser.I-Die ngayinye iyi-chip esebenzayo ezimele, eyakhiwe ngamasekethe amaningi e-transistor, kodwa ingahlanganiswa njengeyunithi ekugcineni Iba i-flash particle chip.Isetshenziswa kakhulu emikhakheni ye-elekthronikhi yabathengi njenge-SSD, i-USB flash drive, imemori khadi, njll.
Iwafa equkethe iwafa ye-NAND Flash, iwafa ihlolwa kuqala, futhi ngemva kokuphumelela ukuhlolwa, iyasikwa futhi ihlolwe kabusha ngemva kokusikwa, futhi ukufa okuqinile, okuzinzile, futhi okunamandla agcwele kuyasuswa, bese kuyahlanganiswa.Kuzokwenziwa ukuhlolwa futhi ukuze kuhlanganiswe izinhlayiya ze-Nand Flash ezibonwa nsuku zonke.
Okunye okuku-wafer akuzinzile, konakele kancane futhi ngenxa yalokho akwanele, noma konakale ngokuphelele.Ngokucabangela ukuqinisekiswa kwekhwalithi, ifektri yokuqala izomemezela ukuthi le mpahla isifile, okuchazwa ngokuqinile njengokulahlwa kwayo yonke imikhiqizo engcolile.
Imboni yokupakisha yasekuqaleni ye-Flash Die izopakishwa ibe yi-EMMC, TSOP, BGA, LGA neminye imikhiqizo ngokwezidingo, kodwa kukhona nokukhubazeka ekupakishweni, noma ukusebenza akusezingeni elijwayelekile, lezi zinhlayiya ze-Flash zizohlungwa futhi, futhi imikhiqizo izoqinisekiswa ngokuhlolwa okuqinile.izinga.
Abakhiqizi bezinhlayiya zenkumbulo ye-Flash bamelwe ikakhulukazi abakhiqizi abaningana abakhulu abanjengoSamsung, i-SK Hynix, iMicron, i-Kioxia (ngaphambili eyayiyi-Toshiba), i-Intel, ne-Sandisk.
Ngaphansi kwesimo samanje lapho i-NAND Flash yangaphandle ibusa imakethe, umkhiqizi waseShayina we-NAND Flash (YMTC) uvele ngokuzumayo wathatha indawo emakethe.I-3D NAND yayo engu-128-layer izothumela amasampula e-3D NAND angu-128 kusilawuli sesitoreji engxenyeni yokuqala ka-2020. njenge-UFS ne-SSD, futhi izothunyelwa kumafekthri amamojula ngesikhathi esifanayo, okuhlanganisa nemikhiqizo ye-TLC ne-QLC, ukuze kwandiswe isisekelo samakhasimende.
Uhlelo lokusebenza nokuthuthuka kwe-NAND Flash
Njengendlela yokugcina idrayivu yesimo esiqinile esebenzayo, i-NAND Flash inezici zayo ezithile zomzimba.Ukuphila kwe-NAND Flash akulingani nempilo ye-SSD.Ama-SSD angasebenzisa izindlela zobuchwepheshe ezihlukahlukene ukuze athuthukise isikhathi sokuphila sama-SSD ewonke.Ngezindlela ezahlukene zobuchwepheshe, isikhathi sokuphila sama-SSD singanyuswa ngo-20% siye ku-2000% uma siqhathaniswa naleyo ye-NAND Flash.
Ngokuphambene, impilo ye-SSD ayilingani nempilo ye-NAND Flash.Impilo ye-NAND Flash ibonakala kakhulu ngomjikelezo we-P/E.I-SSD yakhiwe ngezinhlayiya eziningi ze-Flash.Ngokusebenzisa i-disk algorithm, impilo yezinhlayiya ingasetshenziswa ngokuphumelelayo.
Ngokusekelwe kumgomo kanye nenqubo yokukhiqiza ye-NAND Flash, bonke abakhiqizi abakhulu benkumbulo ye-flash basebenza ngenkuthalo ekuthuthukiseni izindlela ezihlukene zokunciphisa izindleko ngebhithi ngalinye lememori ye-flash, futhi bacwaninga ngenkuthalo ukwandisa inani lezendlalelo eziqondile ku-3D NAND Flash.
Ngokuthuthuka okusheshayo kobuchwepheshe be-3D NAND, ubuchwepheshe be-QLC buyaqhubeka nokuvuthwa, futhi imikhiqizo ye-QLC isiqalile ukuvela ngokulandelana.Kuyabonakala ukuthi i-QLC izongena esikhundleni se-TLC, njengoba nje i-TLC ithatha indawo ye-MLC.Ngaphezu kwalokho, ngokuphindwa kabili okuqhubekayo komthamo we-3D NAND we-single-die, lokhu kuzophinde kuqhubekisele ama-SSD abathengi ku-4TB, ama-SSD asezingeni lebhizinisi ukuthi athuthukele ku-8TB, futhi ama-QLC SSD azoqedela imisebenzi eshiywe ama-TLC SSD futhi kancane kancane athathele ama-HDD.ithinta imakethe ye-NAND Flash.
Ububanzi bezibalo zocwaningo buhlanganisa i-8 Gbit, 4Gbit, 2Gbit kanye nenye inkumbulo ye-flash ye-SLC NAND engaphansi kuka-16Gbit, futhi imikhiqizo isetshenziswa kuma-electronics abathengi, i-inthanethi Yezinto, ezezimoto, izimboni, ezokuxhumana kanye nezinye izimboni ezihlobene.
Abakhiqizi bangempela bamazwe ngamazwe bahola ukuthuthukiswa kobuchwepheshe be-3D NAND.Emakethe ye-NAND Flash, abakhiqizi bokuqala abayisithupha abafana no-Samsung, i-Kioxia (i-Toshiba), i-Micron, i-SK Hynix, i-SanDisk ne-Intel sekuyisikhathi eside belawula ngaphezu kuka-99% wesabelo semakethe yomhlaba wonke.
Ngaphezu kwalokho, izimboni zangempela zamazwe ngamazwe ziyaqhubeka nokuhola ucwaningo nokuthuthukiswa kobuchwepheshe be-3D NAND, zakha izithiyo zobuchwepheshe eziwugqinsi.Kodwa-ke, umehluko ohlelweni lokuklama lwemboni ngayinye yasekuqaleni uzoba nomthelela othile ekuphumeni kwayo.AbakwaSamsung, i-SK Hynix, i-Kioxia, ne-SanDisk bakhiphe ngokulandelana imikhiqizo yakamuva engu-100+ ye-3D NAND.
Okwamanje, ukuthuthukiswa kwemakethe ye-NAND Flash kuqhutshwa ikakhulukazi isidingo sama-smartphones kanye namathebulethi.Uma kuqhathaniswa nemidiya yesitoreji yendabuko efana namadrayivu kanzima emishini, amakhadi e-SD, amadrayivu e-solid-state kanye namanye amathuluzi okugcina asebenzisa ama-NAND Flash chips awanawo umshini, awanamsindo, ukuphila isikhathi eside, ukusetshenziswa kwamandla aphansi, ukwethembeka okuphezulu, usayizi omncane, ukufunda ngokushesha futhi isivinini sokubhala, kanye nezinga lokushisa lokusebenza.Inobubanzi obubanzi futhi iyisiqondiso sokuthuthukiswa kwendawo yokugcina umthamo omkhulu esikhathini esizayo.Ngokufika kwenkathi yedatha enkulu, ama-NAND Flash chips azothuthukiswa kakhulu ngokuzayo.
Isikhathi sokuthumela: May-20-2022
